Quality Standards and Certifications

 Solder Masking

• QS9000: certified by DNV
• ISO 9001: certified by DNV
• ISO 14001: certified by TUV
• ISO/TS16949: certified by TUV
• UL listed
• Conform to IPC Standard
• ROHS Compliant
• Pre-production quality planning by APQP and PFMEA
• Statistical Process Control
• Continuous Improvement Program 

• LPI: Liquid Photo – Imageable Solder Mask
• S/m & C/M Color: Green, Red, Blue, Black, Gold, Clear…
• Finishes: Gloss, Semi-gloss, Matte
• Carbon Ink: Black (6-200 ohm)
• Peelable Ink: Blue
• Min. Annular Opening: 0.003” (min)
• Min. Solder Mask Diameter: 0.003” (min)

 Laminate Types and Tgs

 Manufacturing Capabilities

• CEM-3-86 (Tg-125° c)
• Std. FR4 (Tg-140° c)
• High Tg FR-4 Laminates (Tg-175° c)
• Rogers R03003, 3203, 4003, 5870, 5880 (Tg-280° c)
• GIL MC3D (Tg-140° c)
• Nelco N4105-6 (Tg-175° c)
• Nelco BT Epoxy (Tg-180° c)
• Getek ML200DSS (Tg-127° c)
• Tacioni CER-10 (ceramic)
• Polyclad FR370 Turbo (Tg-170° c)
• Polyclad HR (Tg-180° c)
• Isola IS410 (High Tg, High Td)
• ShengYi S1170 (High Tg, High Td)
• Doosen DS-7409
• Kingboard (High Tg, High Td)

• Max. layer count  24 layers
• Min. hole size 0.2mm (8mil)
• Min. hole tolerance PTH +/- 3 mil, NPTH +/- 2 mil
• Min Buried/Blind hole size 8 mil
• Min Lin width/spacing 3 mil / 3 mil
• Layer to layer registration +/- 2 mil
• Board thickness range 0.1 mm to 3.2 mm
• Min SMT SM bridge 0.1 mm (4 mil) 4 oz (max) 0.5oz (min)
• Max. Active Panel Size 2 Layer 24”x28” Multilayer 22”x26”
• Copper/Cladding Thickness Inner-layer 6oz (max) 0.5oz
  (min) outer layer

 Materials and  Surface Finishing

• Material Halogen Free High Tg, FR4 CEM-3, Teflon, Ceramic,
  Polymide, Metal base and   specific materials as requested
  (For example: Taconic, Nelco, Arlon, Rogers…)

• Surface finishing HASL, Electroless Gold, Electroless Tin,
  Electroless Silver, Selective gold plating, Electrolytic gold
  (Flash Gold). Soft gold, hard gold and Entek (OSP)