Solder Masking
 LPI: Liquid Photo – Imageable Solder Mask- S/m & C/M Color: Green, Red, Blue, Black, Gold, Clear…
- Finishes: Gloss, Semi-gloss, Matte
- Carbon Ink: Black (6-200 ohm)
- Peelable Ink: Blue
- Min. Annular Opening: 0.003” (min)
- Min. Solder Mask Diameter: 0.003” (min)
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Materials and Surface Finishing
 Material Halogen Free High Tg, FR4 CEM-3, Teflon, Ceramic,
Polymide, Metal base and specific materials as requested
(For example: Taconic, Nelco, Arlon, Rogers…)- Surface finishing HASL, Electroless Gold, Electroless Tin,
Electroless Silver, Selective gold plating, Electrolytic gold
(Flash Gold). Soft gold, hard gold and Entek (OSP)
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Laminate Types and Tgs
 CEM-3-86 (Tg-125° c)- Std. FR4 (Tg-140° c)
- High Tg FR-4 Laminates (Tg-175° c)
- Rogers R03003, 3203, 4003, 5870, 5880 (Tg-280° c)
- GIL MC3D (Tg-140° c)
- Nelco N4105-6 (Tg-175° c)
- Nelco BT Epoxy (Tg-180° c)
- Getek ML200DSS (Tg-127° c)
- Tacioni CER-10 (ceramic)
- Polyclad FR370 Turbo (Tg-170° c)
- Polyclad HR (Tg-180° c)
- Isola IS410 (High Tg, High Td)
- ShengYi S1170 (High Tg, High Td)
- Doosen DS-7409
- Kingboard (High Tg, High Td)
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Manufacturing Capabilities
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 Max. layer count 24 layers
- Min. hole size 0.2mm (8mil)
- Min. hole tolerance PTH +/- 3 mil, NPTH +/- 2 mil
- Min Buried/Blind hole size 8 mil
- Min Lin width/spacing 3 mil / 3 mil
- Layer to layer registration +/- 2 mil
- Board thickness range 0.1 mm to 3.2 mm
- Min SMT SM bridge 0.1 mm (4 mil) 4 oz (max) 0.5oz (min)
- Max. Active Panel Size 2 Layer 24”x28” Multilayer 22”x26”
- Copper/Cladding Thickness Inner-layer 6oz (max) 0.5oz
(min) outer layer
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